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Modified Phenolic Resin





ProductJapan Sumitomo Bakelite modified phenolic resin


OriginJapan


Specification20Kg/bag


Highly recommendation first choice solvent based pressure-sensitive adhesive/hot melt adhesive

Sumitomo Bakelite——modified phenolic resin

PR-12603 modified phenolic resin has been widely used by NITTO DENKO and 3M


Sumitomo Bakelite company introduction


Sumitomo Bakelite Co., Ltd. belongs to Japanese Sumitomo Group which is one of four major Japanese Zaibatsu.

Sumitomo Bakelite Co., Ltd. has factory and experimental Lab in Utsunomiya and development base in Japan, Singapore, Taiwan, China.

Sumitomo Bakelite Group is a comprehensive manufacturer of electronic materials. Specializing in the production of phenolic resin!

Supply of semiconductor device fabrication from upstream to downstream of all aspects of the relevant materials, and provide total solutions.


Product model:

Solid Resin


Model

Type of resin

Shape

Melting point

Application

PR-12603

Modified linear

Granular

133

CR,NR,SBR       emulsion adhesive

PR-19900

Alkyl-phenol polyoxyethylene

Chips

80

Enhance the cohesion

PR-51732

Modified linear

Granular

130

CR,NR,SBR       emulsion adhesive


Recommendation model


Modified phenolic resin PR-12603


Product advantages


It has good resistance on high and low temperature-40 ~ 3 00℃

High densityhigh heat resistancehigh weather resistance, can tackify resin in the system as well.


Application

Solvent-based PSAhot melt adhesivecopper/aluminium metal tapeheat resistance environmental tape etc.



                       

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